Copper thickness is a core parameter in PCB design and manufacturing, directly determining the circuit board's current-carrying capacity, heat dissipation efficiency, signal integrity, and long-term operational reliability.

• PCB
• PCB Copper Thickness

ELIC (Every Layer Interconnect) is a core advanced process in high-end HDI (High-Density Interconnect) PCB manufacturing. Unlike traditional HDI, which relies on fixed step counts and restricted layer-to-layer interconnection, ELIC technology completely eliminates inner-layer mechanical through-holes and mechanical buried vias.

• HDI
• Every Layer Interconnect (ELIC) Technology
• HDI High-Density Interconnect

The selection of rigid PCBs, flexible FPCs, and rigid-flex boards directly determines product structural form, electrical performance, reliability, and production yield. No single board type is absolutely superior. The core principles are scenario adaptability, quantifiable parameter matching, compliance with operating conditions, and cost-effectiveness.

• Rigid PCB
• Flexible FPC
• Rigid-Flex Boards

The global AI computing power race has fully entered a cycle of high-power-density iteration. Thermal management has evolved from an auxiliary design aspect of traditional packaging into a core bottleneck constraining the release of high-end AI chip computing power, operational reliability, and the overall lifecycle of equipment.

• Ceramic Substrates
• AI Computing Power
• AI Chip Thermal Management

Currently, Mini LED display technology has been widely integrated into fields such as automotive cockpits, high-end smart kitchen appliances, commercial industrial equipment, and foldable consumer electronics, becoming the core pathway for high-end display product iteration and upgrades.

• Mini LED Light Board
• Rigid-Flex Board
• LED Backlight Rigid-Flex Board

This stackup design specification has been developed by Kinji PCB based on years of hands-on engineering experience in high-layer-count, high-frequency, and high-speed PCB fabrication. It is tailored for high-speed digital circuit scenarios and is applicable to high-speed interface designs such as DDR4/DDR5, PCIe Gen3/Gen4/Gen5, and 25Gbps+ SerDes.

• PCB Stackup Design
• High-Speed PCB Design
• High Speed PCB