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• electronica 2024

There is an increasing demand for ceramic substrate surface metallization technology in the field of electronic packaging to meet the requirements of high current, high voltage powered integrated circuit components and equipment miniaturization. The following is a detailed introduction to this technology.

• Ceramic substrate
• electronic package

When selecting PCB materials, the needs of the project determine the selection of materials. This involves several factors such as electrical performance, mechanical properties, environmental conditions, cost, and manufacturing processes. Here is a guide on how to choose the right PCB material for different project needs

• PCB
• PCB material

Backdrilling is a controlled depth drilling technique used to remove conductive through-hole stubs from copper cylinders in PCB through-holes.

• PCB process
• resin plug process
• back drilling resin plug process

The flammability of the material, also known as flame retardant, self-extinguishing fire resistance, flame resistance, fire resistance, flammability and other combustibility is to assess the ability of the material to resist combustion.

• PCB
• PCB board quality

With the popularity of new energy vehicles, more and more people realize the excellent performance of ceramic substrates, and the demand is also increasing. Compared with the traditional fiberglass board, the ceramic substrate has higher mechanical strength, better high temperature resistance, thermal conductivity and other advantages, in addition, the dimensional stability and chemical stability of the ceramic substrate are also very good. However, the ceramic substrate also has some disadvantages, such as high cost, difficult processing and large interface stress between the conductive layer and the substrate. Therefore, when processing ceramic substrates, it is necessary to choose the appropriate cutting method to ensure the quality and performance of the product. At present, the commonly used cutting methods have laser cutting and water knife cutting, each has different advantages and disadvantages, as follows

• Ceramic substrate
• laser cutting
• water knife cutting

LTCC is a new type of microelectronic packaging technology based on glass-ceramics or glass/ceramic two-phase composites. LTCC technology with its excellent electrical, thermal, mechanical and interconnection characteristics, has become a new generation of passive device miniaturization, integration, multi-functional and system-level packaging of the preferred way, is widely used in a variety of microelectronics device fields, such as high-precision chip components, passive integrated functional devices, passive integrated substrate and micro-electronic functional modules and other packaging products. In recent years, the emergence of emerging technologies such as 5G/6G mobile communication, virtual reality, and artificial intelligence has brought new opportunities for the development of LTCC materials.

• LTCC
• LTCC Ceramics
• Warm Co-fired Ceramics (LTCC)