DPC is a newest development in the field of Ceramic Substrate PCBs, by magnetron sputtering technology to deposit a metal layer (Ti/Cutarget) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns, electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderabili

• DPC Ceramic Substrate
• Direct Plated Copper

DBC substrate, short for Direct Bonded Copper substrate, is an advanced material composed of a ceramic substrate (typically Al2O3or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applic

• DBC Ceramic Substrate

In today's electronics manufacturing industry, High-Density Interconnect (HDI) technology is a critical driver for achieving miniaturization and high performance in electronic products. The key advantage of HDI lies in its precision stack-up design, which not only enhances space utilization efficiency but also improves electrical performance and signal integrity. By optimizing circuit layouts and

• HDI Boards
• Stack-Up Designs in HDI Boards

Solder pads are metal contact points on a PCB (Printed Circuit Board) used for soldering components, and they are also referred to simply as pads. They are formed through a copper coating process and are typically located on the surface and inner layers of the PCB.

• PCB Solder Pads

With the increasing operating speeds of microprocessors and signal conversion/transmission devices, the operating speed of digital circuits has reached a higher level: 100Gbps. Using conventional PCB materials can no longer meet high-speed signal requirements, and the selection of circuit board materials will determine product performance.

• High-Frequency PCB
• High-Speed PCB

Aluminum Nitride (AlN) ceramic, as a next-generation advanced electronic packaging material, has become the preferred solution for high-power integrated circuit substrates due to its exceptional thermoelectric-mechanical synergy.

• Aluminum Nitride (AlN) ceramic