In today's electronics manufacturing industry, High-Density Interconnect (HDI) technology is a critical driver for achieving miniaturization and high performance in electronic products. The key advantage of HDI lies in its precision stack-up design, which not only enhances space utilization efficiency but also improves electrical performance and signal integrity. By optimizing circuit layouts and

• HDI Boards
• Stack-Up Designs in HDI Boards

Solder pads are metal contact points on a PCB (Printed Circuit Board) used for soldering components, and they are also referred to simply as pads. They are formed through a copper coating process and are typically located on the surface and inner layers of the PCB.

• PCB Solder Pads

With the increasing operating speeds of microprocessors and signal conversion/transmission devices, the operating speed of digital circuits has reached a higher level: 100Gbps. Using conventional PCB materials can no longer meet high-speed signal requirements, and the selection of circuit board materials will determine product performance.

• High-Frequency PCB
• High-Speed PCB

Aluminum Nitride (AlN) ceramic, as a next-generation advanced electronic packaging material, has become the preferred solution for high-power integrated circuit substrates due to its exceptional thermoelectric-mechanical synergy.

• Aluminum Nitride (AlN) ceramic

High-speed RF PCB laminates and standard FR4 materials exhibit distinct differences in material properties, performance parameters, and application scenarios.

• FR4 PCB
• High-Speed RF PCB

2-Layer Power Supply Ceramic Board PCB

• Ceramic Board PCB
• 2-Layer Power Supply Ceramic Board PCB