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PRODUCT DETAILS
Product Type: HDI board
Raw Material: FR4 S1000-2
Application Field: Mobile Communication
Layer/Board Thickness: 8L/1.2mm
Surface Treatment: Immersion Gold +OSP
Line Width/Line Distance: 3/3mil
Min. Aperture: 0.10mm
Technical Features: 1-Level HDI
PRODUCT RECOMMENDATION
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See details- 6 Layers HDI PCB, FR4(TG175), 1OZ Cu, Immersion Gold(2u")
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See details- 6 Layers HDI WIFI Module PCB
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See details- 8 Layers Impedance HDI PCB
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See details- 12 Layers 5-Level HDI PCB
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See details- 4 Layers 1-Level Blind & Buried Hole Board
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See details- 10 Layers HDI PCB
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