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Home/ Products/ 3L HDI PCB by Panel Array with FR4 Base Material and 1.0mm Thickness, 2oz Cu, Blind vias: L1-L2
- 3L HDI PCB by Panel Array with FR4 Base Material and 1.0mm Thickness, 2oz Cu, Blind vias: L1-L2
- Board Material Type: FR4(TG175)
- Number of Layers: Three layers
- Board Thickness: 1.0mm
- Surface Treatment: Immersion gold(3u")
- Mini. Line Width/Distance:
PRODUCT DETAILS
Key Specifications/ Special Features:
- Number of layers: Three layers
- Base material: FR4(TG175)
- Thickness: 1.0mm
- Copper thickness: 2oz Cu
- Size: DIA. 8.23mm
- 88pcs/PNL/132.08x137.795mm
- Surface finishing: Immersion gold(3u")
- Solder mask: White
- •Legend: Black
- Blind vias: L1-L2
- •Electric test voltage: 150V
- Compliant with RoHS Directive
<<Please Note>>
Kindly be informed that our production is always accorded to the file (100% provided from the customers).
So, if you have any request of PCB, please provide your completed file & quantity demand for our checking and quotation.
Thanks!!
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