Process & Performance Analysis

Advantages of 2-Level HDI Technology

The 2-level blind & buried HDI structure enables dense routing and microvia interconnection, perfectly matching the high-density pin layout of FPGA chips. With an ultra-thin board thickness of 0.8 mm, it balances routing density and board rigidity, making it a mainstream high-end manufacturing process for touch industrial control mainboards.

Line Width & Aperture Capability

It supports a minimum line width & spacing of 2 mil on inner layers and a 0.2 mm microvia hole size, delivering ultra-high circuit integration to meet high-density routing requirements for touch signal acquisition, signal transmission and FPGA logic operation.

Copper Thickness & Surface Finish

0.5 oz thin copper for inner layers suits fine-line etching of inner circuits; 1 oz copper on outer layers ensures current-carrying capacity for high-current loops.

ENEPIG is applied on precision BGA pads to improve solderability and anti-oxidation performance. OSP is adopted for general circuits to control manufacturing cost, achieving a good balance between performance and cost-effectiveness.

Properties of EM-285 Substrate

This material features stable heat resistance and dielectric properties, low water absorption, and strong adaptability to temperature and humidity variations. It resists deformation during long-duration continuous operation, ideal for commercial self-service terminals with prolonged working hours.

Application Scope

This mainboard is compatible with all types of touch technologies and supports:

• Standard capacitive and resistive touch screens
• Infrared and surface acoustic wave (SAW) touch screens
• Vector pressure sensing touch modules
• Typical terminal equipment: Self-service query kiosks, vertical touch shopping guides, government self-service machines and commercial touch display devices. Widely deployed in public interactive scenarios including shopping malls, government service halls, business halls and libraries.