KINJI 10-Layer Any-Layer HDI PCB: Premium Track Solution, High-Performance Any-Layer Interconnect Architecture

As in-vehicle intelligence, industrial IoT, and embedded AI technologies undergo rapid iterative upgrades, terminal electronic devices continue to advance toward thinner and lighter form factors, higher integration density, higher signal speeds, and enhanced operational reliability. Traditional multilayer PCBs, constrained by their process structures, can no longer meet the complex operating conditions and high-performance requirements of premium equipment. KINJI, with deep expertise in high-end HDI precision manufacturing, proudly launches its 10-Layer Any-Layer HDI PCB. Leveraging advanced process capabilities and stable mass-production quality, this product precisely empowers three core premium tracks—in-vehicle intelligence, industrial IoT, and embedded AI—providing a robust interconnect foundation for high-end electronic products.

I. Precision Engineering Parameters: Forging the Performance Foundation of Premium Hardware

KINJI's 10-Layer Any-Layer HDI PCB employs industry-advanced any-layer interconnect technology combined with a high-precision blind/buried via structure, completely breaking through traditional PCB routing bottlenecks. Within an ultra-thin board structure, it achieves high-density routing layouts and low-loss high-speed signal transmission while maintaining structural strength and long-term operational stability. Its core process parameters fully align with premium precision electronics application standards, perfectly suited for demanding usage scenarios.

Process Highlights: The 0.8mm thin board, combined with an any-layer HDI structure, enables laser blind via interconnection between any layers. Paired with 2mil ultra-fine inner-layer traces and 0.2mm through-holes, it significantly enhances routing density and signal integrity. The Shengyi S1000-2 material offers excellent heat resistance and CAF (conductive anodic filament) resistance, meeting the wide-temperature operating requirements of automotive and industrial applications.

KINJI 10-Layer Any-Layer HDI PCB

II. Scenario-Specific Precision Adaptation: Stable Mass Production Across Three Premium Tracks

Backed by rigorous process standards and superior product performance, KINJI's 10-Layer Any-Layer HDI PCB has achieved large-scale mass production, precisely targeting three high-value domains: in-vehicle intelligence, industrial IoT & machine vision, and embedded AI education & research. It delivers tailored high-performance interconnect solutions that address the specific pain points of each sector.

01 In-Vehicle Intelligent Electronics | Automotive-Grade Reliability, High-Value Premium Track

In-vehicle electronic equipment operates under harsh conditions involving rapid temperature fluctuations, high-frequency vibration, and complex electromagnetic interference, imposing extreme requirements on PCB stability, durability, and safety. This 10-Layer Any-Layer HDI PCB is ideally suited for core automotive intelligent hardware including in-vehicle AI vision domain controllers, new energy vehicle gateways, high-definition dashcam compute motherboards, and in-vehicle infotainment hosts.

The any-layer interconnect architecture supports parallel transmission of multiple HD video streams and multi-protocol data, significantly reducing signal transmission loss and latency;

High-Tg specialty boards withstand a wide temperature range of -40°C to 125°C, effectively preventing board delamination and solder joint failures caused by severe temperature variations;

High-reliability ENIG (Electroless Nickel Immersion Gold) surface finish enhances solderability and oxidation resistance in complex automotive environments, extending device service life.

Proven Deployment: Successfully deployed in infotainment systems and vision domain controllers for leading new energy vehicle manufacturers, achieving a 40% increase in routing density and a 25% reduction in signal transmission latency. The product has passed the full AEC-Q100 automotive qualification and achieved zero-defect mass production at the million-unit scale, with quality validated by top-tier industry clients.

02 Industrial IoT & Machine Vision | Industrial-Grade Stability, High-Precision Computing Foundation

Designed to withstand complex industrial environments including high humidity, dust accumulation, strong electromagnetic interference, and extreme outdoor temperature differentials, this product fully supports industrial core equipment such as machine vision inspection motherboards, AI-powered data acquisition gateways, PLC expansion modules, and photovoltaic energy storage monitoring terminals, delivering sustained, stable operation for industrial intelligent systems.

The 10-layer independent split-routing design enables precise isolation of power, signal, and ground layers, significantly enhancing electromagnetic interference immunity;

Low-CTE (coefficient of thermal expansion) materials effectively suppress thermal deformation during prolonged operation, ensuring ultra-high precision in machine vision inspection and data acquisition;

The ENIG surface finish is well-suited for high-humidity and dusty outdoor conditions, preventing solder joint oxidation and intermittent contact issues to ensure 24/7 stable operation.

Proven Deployment: Mass-deployed in large-scale photovoltaic energy storage monitoring terminal equipment, achieving 99.98% operational stability across -20°C to 85°C conditions, with data acquisition error rates as low as 0.01%. The product has passed the State Grid-level reliability certification and has been widely implemented in large-scale energy storage projects.

03 Embedded AI R&D & STEM Education | High Compatibility and Iterative Agility, Innovation Development Platform

Addressing the needs of fast-paced embedded AI development cycles, multiple reflow soldering processes, and consistent batch-to-batch performance, this product precisely fits NPU deep-learning development boards, intelligent robot main control modules, and university AI STEM training platforms. It comprehensively supports R&D testing, teaching and training, and prototype verification across diverse scenarios.

The high-density any-layer interconnect architecture supports multi-chip co-integration and accommodates high-performance compute modules, meeting complex AI compute scheduling demands;

Ultra-micro via precision processes are compatible with fine-pitch compute chips, ensuring high-speed algorithm execution and high-efficiency, stable data transmission;

Highly compatible board materials withstand multiple reflow cycles, delivering consistent batch-to-batch performance and significantly reducing hardware failure rates and iteration costs for AI R&D and STEM training applications.

Proven Deployment: Providing core PCB hardware for multiple university AI STEM training platforms, compatible with a wide range of mainstream NPU modules, and fully supporting core training scenarios including image recognition and edge intelligent inference. Board-level return rates are as low as 0.5%, ensuring reliable adaptation for daily instruction and algorithmic prototype iteration.

III. Full-Cycle Dedicated Services, Covering R&D to Mass Production

Leveraging its mature and comprehensive high-end PCB R&D and manufacturing system, KINJI offers a full-process, one-stop service encompassing technical enablement, rigorous quality control, and reliable delivery, ensuring efficient project advancement for clients:

Professional Technical Enablement: Our experienced engineering team provides customized technical support including early-stage solution reviews, impedance simulation, and routing optimization, helping to identify and mitigate design flaws and production risks early while enhancing overall product performance;

Full-Process Precision Quality Control: Fully automated intelligent manufacturing, integrated with AOI (automated optical inspection), X-Ray non-destructive inspection, and multiple other quality inspection checkpoints, ensures precision and consistency for every batch;

Flexible Delivery Capabilities: Supporting both small-batch rapid prototyping and large-volume stable delivery, efficiently matching the R&D iteration and production cadence of automotive, industrial, and AI innovation projects.

From the high-reliability demands of in-vehicle intelligence, to the high-stability requirements of industrial IoT, and the high-iteration velocity of embedded AI innovation, KINJI's 10-Layer Any-Layer HDI PCB—with its precision manufacturing, deep scenario adaptability, and proven mass-production stability—precisely addresses the three core challenges of premium electronic devices: high-density routing, high-speed signal transmission, and high-reliability operation. Looking ahead, KINJI will continue to deepen its high-order HDI technology innovation, iterating products and services to empower clients in achieving quality improvement, efficiency gains, and cost optimization, while seizing the high ground in premium industry markets.