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PRODUCT DETAILS
Unit Size: Can be customized according to customer drawings
Processing Technology: Electrolytic Foil
Reinforcing Material: Glass Fiber Cloth Base
Insulating Resin: Polymylimide Resin (PI)
Substrate Material: Adhesive ED
Product Thickness: 0.2mm(Tolerance ±0.03mm)
Copper Thickness: 35μm(0.5oz)
Soldermask Film/Oil: Yellow Film/Black Film/White Film
Plating and Thickness: OSP(12um-36um)
Fire Rating: 94-V0
Temperature Test: Thermal Shock 288℃ 10sec
Dielectric Constant: PI 3.5; AD 3.9
Storage Environment: Dark Vacuum Storage, Temperature <25℃ Humidity <70%
PRODUCT RECOMMENDATION
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