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PRODUCT DETAILS
Number of Layers: 4 Layers+ Copper Substrate
Board Thickness: 5.6mm
Min. Aperture: 0.35mm
Min. Line Width/Line Distance: 1.25mm
Inner Copper Thickness: 1oz
Outer Copper Thickness: 1oz
Surface Treatment: Immersion Gold ENIG
Min. Distance from Hole to Line: 0.185mm
PRODUCT RECOMMENDATION
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