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Thermoelectric Separation of Copper Substrate
Board Material Type: Copper Substrate
Number of Layers: 2 Layers
Board Thickness: 1.6mm
Surface Treatment: OSP
Mini. Line Width/Distance:

PRODUCT DETAILS

Product Name: Copper Substrate PCB

Plate Thickness :1.6MM

Copper Thickness :2OZ

Withstand Voltage :AC2000V

Thermal Conductivity :398w/m.k

Solder Resistance Type: White Oil

Surface Treatment :OSP

E-T Test :100% Computer Short-Circuit Test

Production Process: Thermoelectric Separation Process

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