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PRODUCT DETAILS
Product Name: Ultra-Thin COB Aluminum Substrate /COB Flexible Aluminum Substrate /COB Bending Aluminum Substrate
Product Thickness: Flexible Board 0.2MM(Tolerance +0.03MM)
Copper Thickness :35MM(1OZ)
Number of Layers: 2 Layers
Plating and Thickness :OSP(12UM-36UM)
Insulating Material: Organic Resin
Temperature Test: Thermal Shock 288℃C10SEC
Dielectric Constant :PI3.5AD3.9
Reinforcing Material: Glass Fiber Cloth Base
Soldermask Film/Oil: White Film/Black Film/White Oil and etc
Base Material: Copper/Adhesive ED
Fire Rating :94-V0
Edge Layer Thickness: Thin Type
Flame Retardant Properties :V0 Board
Processing Technology: Rolled Foil
Insulating Resin: Polymylimide Resin (PI)
Storage Environment: Optical Vacuum Storage, Temperature <25 "C Humidity <70%
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