A COB (Chip-on-Board) inverted aluminum substrate is a type of aluminum substrate that employs COB packaging technology, specifically designed for LED lighting equipment. This technology involves mounting the LED chips directly onto the aluminum substrate and connecting them to the circuit through soldering or other methods. The COB packaging technique offers advantages such as high reliability, superior heat dissipation, lower costs, and ease of repair.

The application scope of COB inverted aluminum substrates is extensive, encompassing various lighting devices like LED street lights, LED spotlights, LED industrial and mining lamps, among others. Compared with other packaging technologies, COB inverted aluminum substrates provide higher packaging density and better thermal performance, which can enhance the brightness and lifespan of LEDs while ensuring the stable operation of the equipment.

When manufacturing COB inverted aluminum substrates, it is crucial to select appropriate aluminum substrate materials and thicknesses, along with performing surface treatments and coatings as required. Additionally, during the process of soldering the LED chips, suitable soldering techniques and materials must be utilized to guarantee the reliability and stability of the connections.

In summary, COB inverted aluminum substrates represent an efficient, reliable, and economical LED packaging solution, particularly suitable for a wide range of LED lighting applications that require effective heat dissipation.