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PRODUCT DETAILS
Substrate Type: 99% Alumina Ceramics
Board Thickness: 1.0mm
Conductive Layer: Copper, Nickel, Palladium, Gold
Metal Layer Thickness: 300μm
Surface Treatment: ENEPIG
Metal Single-Sided/Double-Sided: Double-Sided
Conduction Hole: None
PRODUCT RECOMMENDATION
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See details- 2-Layer Power Supply Ceramic Board PCB
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment: Immersion Gold
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See details- 2 Layers Power Supply Ceramic PCB
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment: Immersion Gold
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See details- DBC Aluminum Nitride Ceramic Substrate
- Number of Layers: Single Layer
- Board Thickness: 2.0mm
- Surface Treatment: Immersion Gold 2U"
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See details- DPC Ceramic AI Intelligent Control Board
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment:
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See details- Thin-Film Capacitive Aluminum Nitride Ceramic Substrate
- Number of Layers: Single-Sided
- Board Thickness: 0.4mm
- Surface Treatment: Immersion Gold
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See details- Ceramic Substrates for Power Devices
- Number of Layers: Single-Sided, Double-Sided
- Board Thickness: 0.35-0.5mm
- Surface Treatment: Immersion Silver, Immersion Gold, ENEPIG
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See details- Silicon Carbide Ceramic Substrate PCB
- Number of Layers: 2 Layers
- Board Thickness: 0.38mm
- Surface Treatment: Immersion Silver
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See details- DPC Ceramic Heavy Copper Board
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment:
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