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Home/ Products/ 6-Layer High-Frequency Hybrid Lamination Communication Backplane PCB
- 6-Layer High-Frequency Hybrid Lamination Communication Backplane PCB
- Board Material Type: TU872 + R4350
- Number of Layers: 6 Layers
- Board Thickness: 2.4mm
- Surface Treatment: ENIG
- Mini. Line Width/Distance: 5.9/6.0mil
PRODUCT DETAILS
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