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PRODUCT DETAILS
| Parameter Category | Parameter Name | Specification Details |
|---|---|---|
| Basic Attributes | Product Type | Thick Copper Board |
| Material | IT158 | |
| Layers | 4L | |
| Board Thickness | 1.6mm | |
| Process Parameters | Surface Finish | Lead-Free HASL |
| Line Width/Line Spacing | 10/10 mil | |
| Minimum Hole Diameter | 0.2mm | |
| Technical Features | Copper Thickness & Plated Through-Hole Specification | 3/3/3/3 OZ full-layer copper thickness; 50μm hole copper |
| Product Advantages | High Current Carrying Capacity | The 4-layer uniform 3OZ thick copper design, combined with 50μm enhanced hole copper, ensures stable and uniform current-carrying performance. The conductive and thermal conductivity of the hole walls are fully optimized, eliminating local overheating risks. Suitable for high-power power supplies, industrial control driver boards, energy storage modules, and other continuous high-load circuit applications, ensuring stable transmission of high currents. |
| Board Reliability | IT158 high thermal conductivity and high heat resistance material, paired with a standard 1.6mm board thickness, offers excellent dimensional stability, anti-warpage, and temperature resistance. It can withstand multiple high-temperature soldering cycles and prolonged operating temperature rises, preventing delamination and deformation. Ideal for demanding environments such as industrial controls and automotive electronics. | |
| Precision Process Compatibility | Uniform 10/10 mil line width and spacing, combined with a 0.2mm minimum hole diameter, balances high-density routing and precision small-hole processing. The 50μm hole copper ensures reliable conductivity in small holes, solving the challenge of hole conduction in thick copper boards. Suitable for miniaturized, high-density, high-power product designs. | |
| Heat Dissipation and Energy Efficiency | The full-layer 3OZ thick copper and 50μm hole copper create a three-dimensional heat dissipation path. Combined with the thermal conductivity characteristics of the IT158 material, it rapidly dissipates operational heat, reduces overall temperature rise and energy loss, and improves equipment operational stability and service life. Suitable for high-frequency, high-power, and long-term full-load operation scenarios. | |
| Environmental-Friendly Solderability | Lead-free HASL surface finish complies with RoHS environmental standards. It offers strong solder joint adhesion, excellent oxidation and corrosion resistance, and superior solderability compatible with lead-free soldering processes. Balances environmental requirements with soldering reliability, preventing long-term solder joint failure or oxidation issues, ensuring stable operation of the entire system. | |
| Application Fields | Core Application Scenarios | Industrial high-power driver modules, miniaturized energy storage power supplies, automotive electronic control units, high-frequency communication power supplies, precision industrial control boards, etc. |
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