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| Item | Unit | Kinji · Ceramic Substrate · Manufacturing Capabilities | ||
| Minimum Aperture | mm | 0.05 | ||
| Aperture Taper Tolerance | % | ±30 | ||
| Drilling Hole Position Accuracy | mm | 0.025 | ||
| Slot Tolerance: Length ≥2 Times Width | mm | Long Side ±0.05, Wide Side ±0.025 | ||
| Slot Tolerance: Length <2 Times Width | mm | Long Side ±0.025, Wide Side ±0.010 | ||
| Line Alignment Accuracy | mm | ±0.025, Interlayer Alignment: 0.025 | ||
| Minimum Line Width & Line Distance | mm | 0.075/0.040 | ||
| Overall Line Width Compensation (DPC Process) | mm | 0.02(Regardless of Copper Thickness Limit, DPC Process Only) | ||
| Negative Film Direct Etching Process | mm | 1OZ Copper Thickness Line Width Compensation 0.025; 2OZ Copper Thickness Line Width Compensation 0.05; 3OZ Copper Thickness Line Width Compensation 0.075; 8OZ Copper Thickness Line Width Compensation 0.15 | ||
| Surface Copper Thickness | um | 18、35、70、140、300、400 | ||
| Filling Aspect Ratio | / | 8:1 | ||
| Etching Factor | / | ＞4 | ||
| Metal Dam | um | 50 - 800 | ||
| Ink Thickness (If customer specified thickness, then produce according to customer requirements) | um | Line Surface: ≥10; Line Angle: ≥8 | ||
| Cofferdam Ink Thickness | um | 80 - 120 | ||
| Solder Resistance Alignment Tolerance | mm | ±0.075 | ||
| Min. Width of One Side of Solder Cover Wire | mm | Face Copper 1OZ Min. Width: 0.075;Face Copper 2OZ Min. Width: 0.10;Face Copper 3OZ Min. Width: 0.15;Face Copper 4OZ Min. Width: 0.175 | ||
| Solder Resist Film Character Min. Window Opening (Min. Line Width) | mm | 0.15 | ||
| Min. Silkscreen Line Width | mm | ≥0.12 | ||
| Silkscreen Alignment Tolerance | mm | ±0.15 | ||
| Min. Silkscreen Height | mm | ≥0.75 | ||
| Min. Silkscreen Gap | mm | ≥0.10 | ||
| Immersion Gold | um | Gold Thickness: 0.025-0.10, Nickel Thickness: 2-8 | ||
| Immersion Silver | um | Silver Thickness: 0.2-0.5 | ||
| Immersion Tin | um | Tin thickness: 0.2-1 (Ceramic Substrate Can Not Use HASL Process) | ||
| OSP | / | OSP Film Thickness: 2-5um | ||
| ENEPIG | um | Gold Thickness: 0.025-0.050, Palladium Thickness: 0.025-0.075, Nickel Thickness: 2-8 | ||
| The Nearest Distance Between The Cutting Line and The Line | mm | 0.2 | ||
| Alignment of Top and Bottom Cutting Lines (Alignment Controlled by Double-Sided Scribing Board) | mm | ±0.025 | ||
| Residual Thickness Control Accuracy | mm | ±0.075. The inner scribing depth of the connected board is 1/2 of the thickness of the whole board, and the outer scribing depth of the peripheral board line is 2/3 of the thickness of the whole board | ||
| Offset Accuracy Tolerance | mm | ±0.025 | ||
| Laser Cutting Line Width | mm | 0.1 | ||
| Laser Contour Tolerance | mm | ±0.10 | ||
| LTCC Process Sintered Silver Paste - Thickness | um | 10 - 20 | ||
| LTCC Process Sintered Silver Paste - Line Width | mm | >0.1 | ||
| LTCC Process Sintered Silver Paste - Line Pitch | mm | >0.15 | ||
| Raw Material | Alumina | Alumina | Aluminium Nitride | |
| Content | % | 96 | 99.60 | / |
| Appearance | / | White | White | White |
| Density | g/cm³ | 3.72 | 3.85 | 3.3 |
| Mean Particle Size | um | 3 - 4 | <1.5 | <1 |
| Thermal Conductivity | w/m·k | 22.3 | 29.5 | 170 |
| Coefficient of Thermal Expansion | / | 8x10-6/℃RT~800℃ | 8.2x10-6/℃RT~800℃ | 4.4x10-6/℃RT~800℃ |
| Dielectric Breakdown Source | v/m | 14*10^6 | 18*10^6 | 14*10^6 |
| Impedance Factor | / | >10^14 | >10^14 | >10^14 |
| Dielectric Constant | 1MHz | 9.5 | 9.8 | 9 |
| Dielectric Loss Angle | 1MHz(x10-4) | 3 | 2 | 4 |
| Flexural Strength | Mpa | 350 | 500 | 300 |
| Dimension | mm | 114*114/120*120/127*127/130*140/140*190 | ||
| Thickness | mm | 0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5 | ||
| Warping Degree | % | ≤0.3 | ≤0.3 | ≤0.3 |
| Item | Unit | Kinji · Aluminum Substrate · Manufacturing Capabilities |
| Raw Material Brand | / | Guoji GL11 / Guangzhou Aluminum Substrate |
| Soldermask Ink | / | LAN-BANG Series |
| Finished Copper Thickness | um | 18/25/35/70（0.5oz/0.75oz/1oz/2oz） |
| Board Thickness Range | mm | 0.8 - 2.0 |
| Board Thickness Tolerance (t≥1.0mm) | % | ±10 |
| Board Thickness Tolerance ( t<1.0mm) | mm | ±0.1 |
| Thermal Conductivity | w/mk | 1 - 12 |
| Minimum Line Width | % | ±10 |
| Minimum Clearance | mil | 8（0.2mm） |
| Drilling Diameter | mm | ≥Board Thickness & ≥1.0 |
| Aperture Tolerance | mm | ±0.1 |
| Soldermask Type | / | Photosensitive Ink |
| Soldermask Bridge | mm | 0.15 |
| Minimum Silkscreen Width | mm | ≥0.15 |
| Minimum Silkscreen Height | mm | ≥1.0 |
| Maximum Size | mm | Standard：480*580 Large Size：580*1180(Support Customization) |
| Overall Dimensional Accuracy | mm | ±0.15 |
| Distance Between Circuits and Shapes | mm | ≥0.3（12mil） |
| Panel: No Gap Splicing | / | 0 Gap Splicing (Panel Shipment, the Gap between the Middle Board and the Board is 0) |
| Panel: With Gap Splicing | mm | 2.0 (The gap of the gap splicing should not be less than 2.0mm, otherwise it is more difficult to route edge) |
| Surface Treatment | / | Immersion Gold, Immersion Silver, Immersion Tin, OSP |
| Item | Unit | Kinji · Copper Substrate · Manufacturing Capabilities |
| Number of Layers | L | 1 - 8 |
| Product Type | / | Single-Sided, Double-Sided Sandwich, Single-Sided 2 Layers, Single-Sided 4 Layers, Thermoelectric Separation (Convex Board) |
| PCB Quality Standard | / | IPC-A-600/610 Class III/Class II |
| Thermal Conductivity | W/mK | 1W/ MK-12W /mK, Thermoelectric Separation is 398W(Convex Board) |
| Maximum Copper Substrate PCB Size | mm | 1200*480 |
| Minimum Copper Substrate PCB Size | mm | 5*5 |
| PCB Thickness | mm | 0.5 - 5.0 |
| Finished Copper Thickness | OZ | 1 - 3 |
| Copper Thickness Through Hole Wall | um | 20 - 35 |
| Line Width/Spacing | mil | 1OZ : 4/5mil、2OZ : 6/8mil、3OZ : 10/11mil |
| PCB Warping | % | ≤0.5 |
| Minimum Punching Diameter | mm | 1.0 |
| Minimum Hole Diameter | mm | 0.6 |
| Minimum Soldermask | mm | 0.35 |
| Contour Tolerance | mm | CNC±0.15，punching±0.1mm |
| Circuit Layer Copper Thickness | um | 35、70、105、140、175、210、245、280、315、350 |
| PCB Wiring Tolerance | mm | CNC routing : ±0.1mm, punching : ±0.1 |
| Surface Finish and Thickness | / | ENIG:Au 0.0254um to 0.127um, Ni 5um to 6umOSPHASL(LF): 40um to 100ymsilver plating: Ag 3um to 8umgold plating: Au 0.1um to 0.5um, Ni 4um to 6um |
| 项目 | 项目名称 | 制程能力 |
| 整 体 制 程 能 力 |
层数 | 1-30层 |
| 高频混压HDI | 陶瓷料、PTFE料只能走机械钻盲埋孔或控深钻、背钻等（不能激光钻孔，不能直接压合铜箔） | |
| 高速HDI | 按常规HDI制作 | |
| 激光阶数 | 1-5阶（≥6阶需要评审） | |
| 板厚范围 | 0.1-5.0mm（小于0.2mm，大于6.5mm需评审，） | |
| 最小成品尺寸 | 单板5*5mm（小于3mm需评审） | |
| 最大成品尺寸 | 2-20层21*33inch; 备注：板边短边超出21inch需评审。 | |
| 最大完成铜厚 | 外层8OZ（大于8OZ需评审），内层6OZ（大于6OZ需评审） | |
| 最小完成铜厚 | 1/2oz | |
| 层间对准度 | ≤3mil | |
| 通孔填孔范围 | 板厚≤0.6mm，孔径≤0.2mm | |
| 树脂塞孔板厚范围 | 0.254-6.0mm，PTFE板树脂塞孔需评审 | |
| 板厚度公差 | 板厚≤1.0mm；±0.1mm | |
| 板厚＞1.0mm；±10% | ||
| 阻抗公差 | ±5Ω（＜50Ω），±10%（≥50Ω）；±8%（≥50Ω，需评审） | |
| 翘曲度 | 常规：0.75%，极限0.5%（需评审） 最大2.0% | |
| 压合次数 | 同一张芯板压合≤5次（大于3次需评审） | |
| 材 料 类 型 |
普通Tg FR4 | 生益S1141、建滔KB6160A、国纪GF212 |
| 中Tg FR4 | 生益S1150G(中Tg板材)、建滔KB6165F、建滔KB6165G（无卤） | |
| 高Tg FR4 | 生益S1165（无卤）、建滔KB6167G（无卤）、建滔KB6167F | |
| 铝基板 | 国纪GL12、博宇3系、1-8层混压FR-4 | |
| HDI板使用材料类型 | LDPP（IT-180A 1037和1086）、普通106与1080 | |
| 高CTI | 生益S1600 | |
| 高Tg FR4 | Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR；联茂：IT-180A、 | |
| IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP | ||
| SI；松下:R-5775K（Megtron6）、R-5725（Megtron4）；建滔：KB6167F； | ||
| 台光：EM-827； 宏仁：GA-170；南亚：NP-180；台耀：TU-752、TU-662； | ||
| 日立：MCL-BE-67G（H）、MCL-E-679（W）、 MCL-E-679F（J）；腾辉：VT-47； | ||
| 陶瓷粉填充高频材料 | Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N; | |
| 聚四氟乙烯高频材料 | Rogers系列、Taconic系列、Arlon系列、Nelco系列、TP系列 | |
| PTFE半固化片 | Taconic：TP系列、TPN系列、HT1.5(1.5mil)、Fastrise系列 | |
| 材料混压 | Rogers、Taconic、Arlon、Nelco与FR-4 | |
| 金 属 基 板 |
层数 | 铝基板、铜基板：1-8层；冷板、烧结板、埋金属板：2-24层；陶瓷板：1-2层； |
| 成品尺寸（铝基板、铜基板、冷板、烧结板、埋金属板） | MAX:610*610mm、MIN:5*5mm | |
| 生产尺寸最大（陶瓷板） | 100*100mm | |
| 成品板厚 | 0.5-5.0mm | |
| 铜厚 | 0.5-10 OZ | |
| 金属基厚 | 0.5-4.5mm | |
| 金属基材质 | AL：1100/1050/2124/5052/6061；Copper：紫铜纯铁 | |
| 最小成品孔径及公差 | NPTH：0.5±0.05mm；PTH(铝基板、铜基板)：0.3±0.1mm；PTH(冷板、烧结板、埋金属板)：0.2±0.10mm； | |
| 外形加工精度 | ±0.2mm | |
| PCB部分表面处理工艺 | 有/无铅喷锡；OSP；沉镍(钯)金；电(镍) 软/硬金；电镀锡；无镍电镀软硬金；厚金制作 | |
| 金属表面处理 | 铜：镀镍金；铝：阳极氧化、硬质氧化、化学钝化；机械处理：干法喷沙、拉丝 | |
| 金属基材料 | 全宝铝基板（T-110、T-111）；腾辉铝基板（VT-4A1、VT-4A2、VT-4A3）；莱尔德铝基板（1KA04、1KA06）；贝格斯金属基板（MP06503、HT04503）；TACONIC金属基板（TLY-5、TLY-5F）； | |
| 导热胶厚度（介质层） | 75-150um | |
| 埋铜块尺寸 | 3*3mm—70*80mm | |
| 埋铜块平整度（落差精度） | ±40um | |
| 埋铜块到孔壁距离 | ≥12mil | |
| 导热系数 | 0.3-3W/m.k（铝基板、铜基板、冷板）；8.33W/m.k（烧结板）；0.35-30W/m.k（埋金属板）；24-180W/m.k（陶瓷板）； | |
| 产品类型 | 刚性板 | 背板、HDI、多层埋盲孔、厚铜板、电源厚铜、半导体测试板 |
| 叠层方式 | 多次压合盲埋孔板 | 同一面压合≤3 |
| HDI板类型 | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(n中埋孔≤0.3mm)，激光盲孔可以电镀填孔 | |
| 局部混压 | 局部混压区域机械钻孔到导体最小距离 | ≤10层：14mil；12层：15mil；＞12层：18mil |
| 局部混压交界处到钻孔最小距离 | ≤12层：12mil；＞12层：15mil | |
| 表 面 处 理 |
无铅 | 电镀铜镍金、沉金、镀硬金（有/无镍）、镀金手指、无铅喷锡、OSP、化学镍钯金、 镀软金（有/无镍）、沉银、沉锡、ENIG+OSP、ENIG+G/F、全板镀金+G/F、沉银+G/F、沉锡+G/F |
| 有铅 | 有铅喷锡 | |
| 厚径比 | 10：1（有铅/无铅喷锡，化学沉镍金，沉银，沉锡，化学镍钯金）；8：1（OSP） | |
| 加工尺寸(MAX) | 沉金：520*800mm，垂直沉锡：500*600mm、水平沉锡：单边小于500mm；水平沉 银：单边小于500mm；有铅/无铅喷锡：520*650mm；OSP：单边小于500mm；电镀硬金：450*500mm； 单边不允许超过520mm | |
| 加工尺寸(MIN) | 沉锡：60*80mm；沉银：60*80mm；有铅/无铅喷锡：150*230mm；OSP：60*80mm； 小于以上尺寸的走大板表处 | |
| 加工板厚 | 沉金：0.2-7.0mm，沉锡：0.3-7.0mm（垂直沉锡线）、0.3-3.0mm（水平 线）；沉银：0.3-3.0mm；有铅/无铅喷锡：0.6-3.5mm；0.4mm以下喷锡板需评审制作； OSP：0.3-3.0mm；电镀硬金：0.3-5.0mm（板厚比10:1） | |
| 沉金板IC最小间距或PAD到线最小间距 | 3mil | |
| 金手指高度最大 | 1.5inch | |
| 金手指间最小间距 | 6mil | |
| 分段金手指最小分段间距 | 7.5mil | |
| 钻 孔 |
0.1/0.15/0.2mm机械钻孔最大板厚 | 0.8mm/1.5mm/2.5mm |
| 激光钻孔孔径最小 | 0.1mm | |
| 激光钻孔孔径最大 | 0.15mm | |
| 机械孔直径（成品） | 0.10-6.2mm（对应钻刀0.15-6.3mm） | |
| PTFE材料（含混压）板最小成品孔径0.25mm（对应钻刀0.35mm） | ||
| 机械埋盲孔孔径≤0.3mm（对应钻刀0.4mm） | ||
| 盘中孔绿油塞孔钻孔直径≤0.45mm（对应钻刀0.55mm） | ||
| 连孔孔径最小0.35mm（对应钻刀0.45mm） | ||
| 金属化半孔孔径最小0.30mm（对应钻刀0.4mm） | ||
| 通孔板厚径比最大 | 20:1(不含≤0.2mm刀径；＞12:1需评) | |
| 激光钻孔深度孔径比最大 | 1:01 | |
| 机械控深钻盲孔深度孔径比最大 | 1.3:1(孔径≤0.20mm),1.15:1(孔径≥0.25mm) | |
| 机械控深钻（背钻）深度最小 | 0.2mm | |
| 钻孔-机械钻孔到导体最小距离(非埋盲孔板和一阶激光盲孔) | 5.5mil(≤8层)；6.5mil（10-14）；7mil(＞14层) | |
| 钻孔-机械钻孔到导体最小距离(机械埋盲孔板和二阶激光埋盲孔) | 7mil（一次压合）；8mil(二次压合)；9mil(三次压合) | |
| 钻孔-机械钻孔到导体最小距离(激光盲埋孔) | 7mil（1+N+1）；8mil（1+1+N+1+1或2+N+2） | |
| 钻孔-激光钻孔到导体最小体距离(1、2阶HDI板) | 5mil | |
| 钻孔-不同网络孔壁之间距离最小（补偿后） | 10mil | |
| 钻孔-相同网络孔壁之间距离最小（补偿后） | 6mil(通孔；激光盲孔)；10mil（机械盲埋孔） | |
| 钻孔-非金属孔壁之间距离最小（补偿后） | 8mil | |
| 钻孔-孔位公差（与CAD数据比） | ±2mil | |
| 钻孔-NPTH孔孔径公差最小 | ±2mil | |
| 钻孔-免焊器件孔孔径精度 | ±2mil | |
| 钻孔-锥形孔深度公差 | ±0.15mm | |
| 钻孔-锥形孔孔口直径公差 | ±0.15mm | |
| 焊盘 （环） |
激光孔内、外层焊盘尺寸最小 | 10mil（4mil激光孔），11mil（5mil激光孔） |
| 机械过孔内、外层焊盘尺寸最小 | 16mil（8mil孔径） | |
| BGA焊盘直径最小 | 有铅喷锡工艺10mil，无铅喷锡工艺12mil，其它工艺7mil | |
| 焊盘公差（BGA） | +/-1.2mil（焊盘＜12mil）；+/-10%（焊盘≥12mil） | |
| 线 宽 / 间 距 |
铜厚对应的极限线宽 | 1/2OZ：3/3mil |
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| 线宽公差 | ≤10mil：+/-1.0mil | |
| ＞10mil：+/-1.5mil | ||
| 阻 焊 字 符 |
阻焊塞孔最大钻孔直径（两面盖油 | 0.5mm |
| 阻焊油墨颜色 | 绿、黄、黑、蓝、红、白、紫、哑光绿、哑油黑、高折射白油 | |
| 字符油墨颜色 | 白、黄、黑 | |
| 蓝胶铝片塞孔最大直径 | 5mm | |
| 树脂塞孔钻孔孔径范围 | 0.1-1.0mm | |
| 树脂塞孔最大厚径比 | 12:01 | |
| 阻焊桥最小宽度 | 绿油4mil、杂色6mil 控制阻焊桥需特别要求 | |
| 最小字符线宽宽度 | 白色字符3mil 高24mil； 黑色字符5mil 高32mil | |
| 镂空字最小间距 | 镂空宽度8mil 高40mil | |
| 阻焊层镂空字 | 镂空宽度8mil 高40mil | |
| 外 形 |
V-CUT不漏铜的中心线到图形距离 | H≤1.0mm:0.3mm(20°指V-CUT角度)、0.33mm(30°)、0.37mm(45°); |
| 1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | ||
| 1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | ||
| 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
| V-CUT对称度公差 | ±4mil | |
| V-CUT线数量最多 | 100条 | |
| V-CUT角度公差 | ±5度 | |
| V-CUT角度规格 | 20、30、45度 | |
| 金手指倒角角度 | 20、30、45度 | |
| 金手指倒角角度公差 | ±5度 | |
| 金手指旁TAB不倒伤的最小距离 | 6mm | |
| 金手指侧边与外形边缘线最小距离 | 8mil | |
| 控深铣槽（边）深度精度（NPTH） | ±0.10mm | |
| 外形尺寸精度(边到边) | ±8mil | |
| 铣槽槽孔最小公差（PTH） | 槽宽、槽长方向均±0.15mm | |
| 铣槽槽孔最小公差（NPTH） | 槽宽、槽长方向均±0.10mm | |
| 钻槽槽孔最小公差（PTH） | 槽宽方向±0.075mm；槽长/槽宽<2:槽长方向+/-0.1mm；槽长/槽宽≥2:槽长方向+/-0.075mm | |
| 钻槽槽孔最小公差（NPTH） | 槽宽方向±0.05mm；槽长/槽宽<2:槽长方向+/-0.075mm；槽长/槽宽≥2:槽长方向+/-0.05mm |
| Item | Unit | Kinji · HDI PCB · Manufacturing Capability |
| Product Type | / | HDI ELIC（5+2+5） |
| Number of PCB Layers | L | 1 -32 |
| Board Thickness | mm | Inner Core Thickness：0.05 - 1.5；Finished Thickness：0.3 -3.5 |
| Minimum Aperture | mm/mil | Laser Drill: 0.075mm/3mil Mechanical Drill: 0.15mm/6mil |
| Minimum Line Width/Line Distance | mm | 0.030/0.030(1.2mil/1.2mil) |
| Copper Foil Thickness | OZ | 1/2 - 5 |
| Maximum Manufacturing Size | mm | 700*610 |
| Interlayer Alignment | mm | ± 0.05(2mil) |
| Contour Alignment | mm | ±0.075(3mil) |
| Minimum BGA PAD | mm | 0.15(8mil) |
| Aspect Ratio | / | 10:1 |
| Board Bending | % | 0.5 |
| Impedance Tolerance | % | ±8 |
| Daily Production Capacity | m² | 3000 |
| Commonly Used Raw Materials | / | FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI |
| Surface Treatment | / | Electroplating Nickel/Gold, OSP, HASL, Gold Plating, Immersion Tin |
| Item | Unit | Kinji · FPC · Manufacturing Capabilities |
| Maximum Layers | L | 16 |
| Minimum Finished Board Thickness | mm | 0.04 |
| Maximum Size | mm | 500*2200 |
| Minimum Laser Drilling | mm | 0.025 |
| Minimum Mechanical Drilling | mm | 0.1 |
| Minimum Line Width/Line Distance | mm | 0.035/0.035 |
| Minimum Single and Double Panel Ring Width | mm | 0.075 |
| Minimum Inner Ring Width of Multilayer Board | mm | 0.1 |
| Minimum Outer Ring Width of Multilayer Board | mm | 0.1 |
| Minimum Covering Film Bridge | mm | 0.1 |
| Minimum Soldermask Window Opening | mm | 0.15 |
| Minimum Covering Film Window Opening | mm | 0.30*0.30 |
| Minimum BGA Pitch | mm | 0.45 |
| Single-Ended Impedance Tolerance | % | ±7 |
| Raw Material Type | / | Polymide、LCP、PET |
| Raw Material Brand | / | Shengyi, ITEQ, Taihong, Xinyang, Xingao, Panasonic, DuPont, Jiujiang |
| Stiffener Type | / | FR4, PI, PET, Steel, Aluminum, PSA, Nylon |
| Surface Treatment | / | Immersion Gold, ENEPIG, OSP, Gold Plating, Gold Plating + Immersion Gold, Gold Plating +OSP, Immersion Silver, Immersion Tin, Tin Plating |
| Item | Unit | Kinji · Rigid-Flex Board · Manufacturing Capabilities |
| Highest Layer Number | L | 30 |
| Maximum Finished Board Thickness | mm | 4.0 |
| Maximum Production Size | mm | 500*1000 |
| Minimum Laser Drilling | mm | 0.075 |
| Maximum Thickness to Diameter Ratio | / | 13:1 |
| Minimum Inner Line Width/Line Spacing | mm | 0.04/0.04 |
| Minimum Outer Line Width/Line Spacing | mm | 0.05/0.05 |
| Solder Resistance Alignment Tolerance | mm | 0.035 |
| Minimum Soldermask Bridge | mm | 0.08 |
| Minimum BGA Pitch | mm | 0.08 |
| Single-Ended Impedance Tolerance | mm | 0.45 |
| Single-Ended Impedance Tolerance | % | ±7 |
| Raw Material | / | Medium TG, High TG, Low Dielectric Constant, Low Loss FR4, High Frequency Materials |
| Raw Material Brand | / | Shengyi, Ventec, ITEQ, Rogers, Panasonic, DuPont, Taihong |
| Surface Treatment | / | Immersion Gold, ENEPIG, OSP, Gold Plating, Gold Plating + Immersion Gold, Gold Plating +OSP, Immersion Silver, Immersion Tin, Tin Plating |
| Rigid-Flex+HDI | / | 3+N+3(Samples) |
| Item | Unit | Kinji · High Frequency High Speed Board · Manufacturing Capabilities |
| Number of Layers | L | 2 - 30 |
| Maximum Board Thickness | mm | 8.0 |
| Finished Copper Thickness | OZ | 0.5 - 5 |
| Board Thickness Tolerance | % | ±10 |
| Maximum Finished Size | mm | 570*670 |
| Minimum Finished Size | mm | 1*1 |
| Overall Dimensional Accuracy | mm | ±0.075 |
| Slot Dimensional Accuracy | mm | ±0.075 |
| Minimum Hole to Conductor Distance | mil | 5 |
| Minimum Aperture | mm | 0.05 |
| Minimum BGA Pitch | mm | 0.4 |
| The Minimum Hole Wall Spacing of Different Networks | mm | 0.2 |
| Aperture Tolerance | mil | ±2.0（PTH)；±1.0（NPTH) |
| Hole Tolerance | mil | ±2 |
| Back Drilling | mil | 4 |
| Ratio of Thickness to Diameter | / | 20:1 |
| Linewidth Accuracy | um | ±20 |
| Warping Degree | % | 0.75 |
| Wire Width Control | mm | ±0.02 |
| Impedance Tolerance | %（≥50Ω） | ±8 |
| Hole Copper Thickness | um | Min ≥18 且 Avg≥20 |
| Soldermask Thickness | um | 20 - 30 |
| High Frequency PCB Type | / | 6GHz to 24GHZ PCB, 70GHZ PCB, Embedded Antenna PCB, Ceramic Hybrid Base HF PCB, PTFE-based HF PCB |
| Bottom Copper Thickness | OZ | 0.5 - 1.0 |
| Thermal Conductivity | w/mk | 0.15 - 0.95 |
| PCB Through Hole | / | Blind Hole, Overlapping Hole, Staggered Hole, Jumping Hole, Buried Hole |
| Thermal Stress | / | 10 seconds at 288°C |
| Electric Conductivity | / | ℇ2.1 - ℇ10.0 |
| Stamping or Wiring Error | mm | ±0.10 - 0.13 |
| Wall Copper | um | ≥ 20 |
| Soldermask Ink | / | Taiyo PSR4000,Tamura DSR2200 |
| Raw Material | / | Epoxy Resin, PTFE Resin, HC Resin, PPO PPE Resin |
| Surface Treatment | / | Immersion Gold, Immersion Silver, Gold Plating, Immersion Tin, Tin Plating |
| Special Surface Treatment | / | Copper Base Pure Thick Gold, Copper Base Palladium Gold, Nickel Base Thick Hard Gold and etc. |
| Item | Item Name | Manufacturing Capabilities |
| Overall Manufacturing Capacity | Number of Layers | 1-30L |
| High Frequency Hybrid Pressing HDI | Ceramic materials, PTFE materials can only be mechanically drilled blind holes or controlled deep drilling, backdrilling, etc. (Can not use laser drilling, can not directly press copper foil either) | |
| High Speed HDI | Made according to regular HDI | |
| Number of Laser Levels | Level 1-5 (Level 26 need to be reviewed) | |
| thickness range | 0.1-5.0mm (less than 0.2mm, more than 6.5mm need to be reviewed) | |
| Minimum Finished Size | Single Board 5 x 5mm (Less than 3mm must be reviewed) | |
| Maximum Finished Size | 2-20 layers 21*33 inch; Note: Board edges in short side exceeding 21 inch should be reviewed | |
| Maximum Finished Copper Thickness | Outer layer 8OZ(If higher than 8OZ needs to be reviewed), Inner layer 6OZ(If higher than 6OZ needs to be reviewed) | |
| Minimum Finished Copper Thickness | 1/2oz | |
| Interlayer Alignment | ≤3mil | |
| Through Hole Filling Range | Board Thickness <0.6mm, Aperture s0.2mm | |
| Resin Plug Hole Board Thickness Range | 0.254-6.0mm, PTFE board resin plug hole need to be reviewed | |
| Board Thickness Tolerance | Board Thickness <1.0mm; ± 0.1mm | |
| Board Thickness >1.0mm; ± 10% | ||
| Impedance Tolerance | ±5Ω (<50Ω), ±10% (≥50Ω); ±8% (≥50Ω, need to be reviewed) | |
| Warping Degree | General: 0.75%, Utmost 0.5% (need to be reviewed) Maximum 2.0% | |
| Number of Pressing | Press the same core board 35 times (more than 3 times need to be reviewed) | |
| Material Type | Ordinary Tg FR4 | Shengyi S1141, Kingboard KB6160A, Guoji GF212 |
| Medium Tg FR4 | Shengyi S1150G (Medium Tg Material), Kingboard KB6165F, Kingboard KB6165G (Halogen-Free) | |
| High Tg FR4 | Shengyi S1165 (Halogen-Free), Kingboard KB6167G (Halogen-Free), Kingboard KB6167F | |
| Aluminum Substrate | Guoji GL12, Boyu 3 Series, 1-8 Layers of Mixed Pressing FR-4 | |
| Type of Material Used for HDI Board | LDPP (IT-180A 1037 and 1086), ordinary 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 | Isola: FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; ITEQ: IT-180A | |
| IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP | ||
| SI; Panasonic：R-5775K (Megtron6), R-5725 (Megtron4), Kingboard: KB6167F | ||
| Taiguang: EM-827; Hongren: GA-170; South Asia: NP-180; Taiyao: TU-752, TU-662 | ||
| Hitachi: MCL-BE-67G（H）, MCL-E-679（W)、MCL-E-679F（J）; Ventec：VT-47 | ||
| Ceramic Powder Filled High Frequency Material | Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N; | |
| Polytetrafluoroethylene High Frequency Material | Rogers series, Taconic series, Arlon series, Nelco series, TP series | |
| PTFE Prepreg | Taconic: TP series, TPN series, HT1.5(1.5mil), Fastrise series | |
| Mixed Pressing of Materials | Rogers、Taconic、Arlon、Nelco and FR-4 | |
| Metal-Based Board | Number of Layers | Aluminum Substrate, Copper Substrate :1-8 Layers; Cold Board, Sintered Board, Buried Metal Board :2-24 Layers; Ceramic Substrate :1-2 Layers |
| Finished Size (Aluminum, Copper, Cold, Sintered, Buried Metal) | MAX:610*610mm、MIN:5*5mm | |
| Maximum Production Size (Ceramic Substrate) | 100*100mm | |
| Finished Board Thickness | 0.5-5.0mm | |
| Copper Thickness | 0.5-10 OZ | |
| Metal Base Thickness | 0.5-4.5mm | |
| Metal Base Material | AL:1100/1050/2124/5052/6061; Copper: Purple Copper Pure Iron | |
| Minimum Finished Aperture and Tolerance | NPTH: 0.5±0.05mm; PTH(Aluminum Substrate, Copper Substrate): 0.3±0.1mm; PTH(Cold, Sintered, Buried Metal): 0.2±0.10mm | |
| Contour Machining Accuracy | ±0.2mm | |
| Partial PCB Surface Treatment Process | With/Without Lead HASL; OSP; ENEPIG; Electrical (Nickel) Soft/Hard Gold; Tin Plating; Nickel-Free Electroplating Soft/Hard Gold; Thick Gold Plating | |
| Metal Surface Treatment | Copper: Nickel/Gold Electroplating; Aluminum: Anodic Oxidation, Hard Oxidation, Chemical Passivation; Mechanical Treatment: Dry Sand Blasting, Wire Drawing | |
| Metal-Based Material | Quanbao Aluminum Substrate(T-110、T-111); Ventec Aluminum Substrate(VT-4A1、VT-4A2、VT-4A3); Laird Aluminum Substrate(1KA04、1KA06); Berges Metal Substrate(MP06503、HT04503); TACONIC Metal Substrate (TLY-5、TLY-5F) | |
| Thermal Adhesive Thickness (Dielectric Layer) | 75-150um | |
| Buried Copper Block Size | 3*3mm—70*80mm | |
| Flatness of Copper Block | ±40um | |
| Distance from Copper Block to Hole Wall | ≥12mil | |
| Thermal Conductivity | 0.3-3W/m.k(Aluminum Substrate, Copper Substrate, Cold Board); 8.33W/m.k(Sintered Board); 0.35-30W/m.k(Buried Metal); 24-180W/m.k(Ceramic Substrate) | |
| Product Type | Rigid Board | Back Dirlling, HD, Multilayer Blind & Buried Hole Board, Heavy Copper Board, Power Supply Heavy Copper, Semiconductor Test Board |
| Stacked-Up Method | Blind & Buried Hole Board with Multiple Times Pressing | Press together on the same side<3 |
| HDI Board | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(Buried Holes in n<0.3mm)，Laser blind holes can be electroplated and filled | |
| Partial Mixed Pressing | Minimum Distance from Mechanical Drilling to Conductor in Local Mixed Pressing | ≤10 Layers:14mil;12 Layers:15mil;>12 Layers:18mil |
| Minimum Distance between Local Mixed Pressing Junction and Borehole | ≤12 Layers:12mil;>12 Layers:15mil | |
| Surface Treatment | Without Leaded | Electroplating Copper Nickel Gold, Immersion Gold, Hard Gold Plating (With/Without Nickle), Gold Fingers Plating, HASL LF, OSP, ENEPIG, Soft Gold Plating (With/Without Nickle), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+G/F, Full Board Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F |
| With Leaded | HASL | |
| Ratio of Thickness to Diameter | 10:1(With/Without Leaded HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG);8:1(OSP) | |
| Processing Size (MAX) | Immersion Gold: 520*800mm, Vertical Immersion Tin: 500*600mm, Horizontal Immersion Tin: Single Sided ≤500mm; Horizontal Immersion Silver: Single Sided ≤500mm; With/Without Leaded HASL: 520*650mm; OSP: Single Sided ≤500mm; Hard Gold Plating: 450*500mm; Single Sided is not allowed to over 520mm | |
| Processing Size(MIN) | Immersion Tin: 60*80mm; Immersion Silver: 60*80mm; With/Without Leaded HASL: 150*230mm; OSP: 60*80mm; Smaller than the above size of the large board table | |
| Machined Board Thickness | Immersion Gold:0.2-7.0mm，Immersion Tin:0.3-7.0mm(Vertical Immersion Tin Line)、0.3-3.0mm(Horizontal Immersion Tin Line);Immersion Silver:0.3-3.0mm;With/Without Leaded HASL:0.6-3.5mm;0.4mmThe following tin-spraying plates need to be made by review;OSP:0.3-3.0mm;Hard Gold Plating:0.3-5.0mm(Board Thickness Ratio10:1) | |
| Minimum Pitch of Metal Board IC or PAD to Wire | 3mil | |
| Gold Fingers Highest Height | 1.5inch | |
| Minimum Distance between Gold Fingers | 6mil | |
| Segment Gold Fingers Minimum Segment Spacing | 7.5mil | |
| HASL | 2-40um(The thinnest thickness of the large tin surface with lead spray tin is 0.4um, and the thinnest thickness of the large tin surface without lead spray tin is 1.5um) | |
| OSP | Film Thickness:0.2-0.4um | |
| ENIG | Nickle Thickness:3-5um;Gold Thickness:1-3uinch，>3uinch Need to be reviewed | |
| Immersion Silver | 6-12uinch | |
| Immersion Tin | Tin Thickness>1um | |
| Hard Gold Plating | 2-50uinch | |
| Soft Gold Plating | Gold Thickness0.10-1.5um(Dry film plating process)，Gold Thickness0.10-4.0um(Non-dry film plating process) | |
| ENEPIG | Nl:3-5um，Pd:1-6uinch，Au:1-4uinch | |
| Electroplating Copper Nickel Gold | Gold Thickness0.025-0.10um，Nickle Thickness>3um，MAX. Copper Base Thickness10Z | |
| Gold Fingers Plated with Nickel | Gold Thickness1-50uinch(Required value refers to the thinnest point)，Thickness>3um | |
| Carbon Oil | 10-50um | |
| Green Ink | Copper cover with oil(10-18um)、Cover the hole with oil(5-8um)、Line corner>5um(One printing, copper thickness below 48um) | |
| Blue Glue | 0.20-0.80mm | |
| Drilling | Mechanical hole diameter (finished product) | 0.10-6.2mm(corresponding drilling tool 0.15-6.3mm) |
| PTFE material (mixed pressure) plate minimum finished diameter 0.25mm(corresponding drilling tool 0.35mm) | ||
| Mechanical buried blind hole diameter ≤0.3mm(corresponding drilling tool 0.4mm) | ||
| Green oil plug hole drilling diameter ≤0.45mm(corresponding drilling tool 0.55mm) | ||
| Minimum hole diameter 0.35mm(corresponding drilling tool 0.45mm) | ||
| Metallized half hole diameter 0.30mm minimum (corresponding drilling tool 0.4mm) | ||
| The thick-diameter ratio of the through-hole plate is the largest | 20:1(Not Including<0.2mmTool diameter ;>12:1Need to be reviewed) | |
| Laser drilling depth aperture ratio is maximum | 1:01 | |
| Mechanically controlled depth drilling has the largest ratio of blind hole depth to aperture | 1.3:1(aperture<0.20mm),1.15:1(aperture≥0.25mm) | |
| Minimum depth of mechanical control drilling (back drilling) | 0.2mm | |
| Drilling - Minimum distance from mechanical drilling to conductor (unburied blind plate and first-order laser blind hole) | 5.5mil(≤8L);6.5mil(10-14);7mil(>14L) | |
| Drilling - Minimum distance from mechanical drilling to conductor (mechanical buried blind plate and second-order laser buried blind hole) | 7mil(One Time Pressing);8mil(Two Times Pressing);9mil(Three Times Pressing) | |
| Drilling - Minimum distance from mechanical drilling to conductor (laser blind hole) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | |
| Drilling - Minimum distance from laser drilling to conductor body (1st and 2nd order HDI boards) | 5mil | |
| Drilling - Minimum distance between hole walls of different networks (after compensation) | 10mil | |
| Drilling - Minimum distance between holes in the same network (after compensation) | 6mil(Through-hole; Laser blind hole);10mil(Mechanical blind & buried hole) | |
| Drilling - Minimum distance between borehole and non-metal wall (after compensation) | 8mil | |
| Drilling-to-hole tolerance (compared to CAD data) | ±2mil | |
| Drilling -NPTH hole diameter tolerance is minimal | ±2mil | |
| Drilling - Precision of hole aperture of solderless device | ±2mil | |
| Drilling - taper hole depth tolerance | ±0.15mm | |
| Drilling - taper hole diameter tolerance | ±0.15mm | |
| Pad | Laser hole inner and outer pad size is minimum | 10mil(4mil Laser Hole)，11mil(5mil Laser Hole) |
| The inner and outer pads of mechanical holes are the smallest | 16mil(8mil Aperture ) | |
| BGA pad has the smallest diameter | HASL Process10mil，HASL LF Process12mil，Other Process7mil | |
| Pad tolerance (BGA) | +/-1.2mil(Pad<12mil);+/-10%(Pad>12mil) | |
| Line width/spacing | Copper thickness corresponding to the limit line width | 1/2OZ:3/3mil |
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ:20/20mil | ||
| 7OZ:24/24mil | ||
| 8OZ:28/28mil | ||
| 9OZ:30/30mil | ||
| 10OZ: 32/30mil | ||
| Line width tolerance | ≤10mil: +/-1.0mil | |
| >10mil: +/-1.5mil | ||
| Soldermask & Silkscreen | Solder resistance jack maximum drilling diameter (covered with oil on both sides) | 0.5mm |
| Soldermask ink color | Green, yellow, black, blue, red, white, purple, matte green, matte black, high refraction white oil white, yellow, black | |
| Silkscreen ink color | 5mm | |
| Maximum diameter of the jack hole of the blue rubber aluminum sheet | 0.1-1.0mm | |
| Resin jack hole bore range | 12:01 | |
| Maximum thickness to diameter ratio of resin jack | Green ink4mil、motley color 6mil Special requirements are required to control solder resistance Bridges | |
| Minimum width of solder shield bridge | White Silkscreen 3mil Height 24mil;Black Silkscreen 5mil Height 32mil | |
| Minimum character linewidth width | Hollow width 8mil Height 40mil | |
| Minimum spacing between hollow words | Hollow width 8mil Height 40mil | |
| Shape | V-CUT does not leak the distance from the center line of copper to the figure | H≤1.0mm:0.3mm(20° means V-CUT angle), 0.33mm(30°), 0.37mm(45°); |
| 1.0<H≤1.6mm:0.36mm(20°), 0.4mm(30°), 0.5mm(45°); | ||
| 1.6<H≤2.4mm:0.42mm(20°), 0.51mm(30°), 0.64mm(45°); | ||
| 2.4<H≤3.2mm:0.47mm(20°), 0.59mm(30°), 0.77mm(45°); | ||
| V-CUT symmetry tolerance | ±4mil | |
| V-CUT has the largest number of cables | 100 Times | |
| V-CUT Angle tolerance | ±5° | |
| V-CUT Angle specifications | 20°、30°、45° | |
| Goldfinger chamfer Angle | 20°、30°、45° | |
| Goldfinger chamfer Angle tolerance | ±5° | |
| The minimum distance to TAB a goldfinger without getting hurt | 6mm | |
| Minimum distance between the side of the gold finger and the contour edge line | 8mil | |
| Depth control groove depth accuracy (NPTH) | ±0.10mm | |
| Overall dimensional accuracy (edge to edge) | ±8mil | |
| Milling groove hole minimum tolerance (PTH) | Groove width and groove length direction are equal±0.15mm | |
| Milling groove Hole minimum tolerance (NPTH) | Groove width and groove length direction are equal+0.10mm | |
| Minimum tolerance (PTH) | Slot width direction+0.075mm;Slot length/slot width<2:Slot length direction+/-0.1mm;Slot length/slot width>2:Slot length direction+/-0.075mmSlot width direction+0.05mm;Slot length/slot width<2:Slot length direction+/-0.075mm;Slot length/slot width>2:Slot length direction+/-0.05mm | |
| Minimum tolerance (NPTH) |
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