Qinji 6-Layer HDI Rigid-Flex PCB: High-Density & Reliable Interconnect for Smart Devices

As smart devices continue to pursue slimmer profiles and higher performance, traditional PCBs can no longer meet the demands of complex application scenarios. Qinji’s newly launched 6-layer HDI rigid-flex PCB, with its innovative structure and premium manufacturing process, redefines the possibilities of high-density interconnection.

Precision Composite Structure

Designed with 4-layer HDI rigid board + 2-layer flex board, it combines rigid mechanical support and flexible bending, perfectly suited for 3D interconnection scenarios such as folding structures and rotating shafts.

Premium Process Parameters

• Ultra-thin board thickness of only 1.6 mm, freeing up valuable internal space for compact devices
• Minimum hole diameter: 0.1 mm
• Minimum BGA pitch: 0.2 mm, supporting high-density chip placement
• Rigid board line width/space: 4/4 mil
• Flex board line width/space: 2.5/2.5 mil, enabling precision signal transmission

High-Quality Base Materials

Combination of Shengyi S7136H rigid material and Taiwan Rainbow FPCL flex material, delivering excellent electrical performance and mechanical toughness for harsh operating conditions.

Core Advantages of Qinji 6-Layer HDI Rigid-Flex PCB

Ultra-Precision Layout for High-Density Applications

With a minimum aperture of 0.1 mm, 0.2 mm BGA capability, fine line width/space of 4/4 mil (rigid) and 2.5/2.5 mil (flex), Qinji 6-layer HDI rigid-flex PCB achieves ultra-dense circuit layout. It reliably supports complex signal transmission and power delivery, providing core support for miniaturized and highly integrated electronic devices.

Dual-Material Synergy for Dual Performance Assurance

The integrated design uses Shengyi S7136H for rigid stability and electrical performance, and flex PCB materials for dynamic bending and 3D space adaptation. It balances structural strength and flexibility, easily adapting to complex assembly environments.

Integrated Structure Breaking Design Limits

The innovative 4-layer HDI rigid + 2-layer flex integrated structure enables flexible interconnection between boards and modules without extra connectors. This greatly reduces connection loss, improves signal stability, simplifies internal assembly, and lowers production and maintenance costs.

Featured Applications

Case 1: Automotive Domain Controller for Leading Automaker

Challenge:

The domain controller must integrate multiple high-definition cameras and radar data processing modules in a limited space, while enduring vibration and extreme temperature changes during vehicle operation.

Solution:

Qinji 6-layer HDI rigid-flex PCB uses flexible layers for 3D wiring and flexibly connects core computing chips with sensor interfaces, ensuring signal integrity and anti-vibration performance.

Results:

Passed automotive-grade reliability testing, operating stably from -40°C to 85°C. It supports L2+ intelligent driving functions and has been mass-produced in multiple vehicle models.

Case 2: Industrial Drone Gimbal Control Board

Challenge:

The drone gimbal requires frequent pitching and rotation, while transmitting high-definition video and control signals. Traditional rigid PCBs cannot withstand repeated bending and high-altitude vibration.

Solution:

Qinji rigid-flex PCB serves as the dynamic connection at the gimbal shaft, with rigid sections carrying core control chips and realizing 3D wiring.

Results:

No signal attenuation after 100,000 bending tests. Stable video transmission is maintained even in 7-level gusts, helping the customer increase market share by 20%.

Case 3: High-End Foldable Smartphone Mainboard

Challenge:

Foldable phones demand extreme thinness while integrating 5G, fast charging, and imaging functions. The flexible hinge must withstand over 200,000 folds.

Solution:

Qinji 6-layer HDI rigid-flex PCB uses 2 flex layers for hinge connection and 4 rigid layers for chips and interfaces, with precision 2.5/2.5 mil line width/space for high integration.

Results:

Verified to endure 200,000 folding cycles. It enables slimmer designs and longer product life, becoming a key competitive advantage for flagship foldable devices.

Why Choose Qinji?

• Technical Expertise: Deep experience in PCB manufacturing, mastering core HDI rigid-flex technology for high-precision, high-reliability mass production.
• Customization: Flexible layer count, line width/space, and material solutions tailored to customer applications.
• Quality Assurance: Strict full-process quality control and multiple industry certifications for stable performance in extreme environments.
• Proven Success: Successful deployments in automotive, drone, and consumer electronics, highly recognized by leading customers.

• From safe intelligent driving and high-altitude drone operation to the premium experience of foldable smartphones, Qinji 6-layer HDI rigid-flex PCB provides the high-density, reliable foundation for product innovation.

• Choose Qinji — choose a more efficient, reliable, and competitive PCB solution.