Number of Layers: 10L

Materials: Laminate IT968TC by Unimicron + S1000-2M by Shengyi

Board Thickness: 1.0±0.1mm

Minimum Hole Diameter: Laser Drilled: 0.10mm; Mechanically Drilled: 0.15mm

Minimum Line Width/Line Spacing: 100/100um

Surface Finish: Gold Plating 2u"+ Locally Thick Gold Plating 50u"

Application Area: 5G Communication Base Stations

Key Features:

• High-frequency hybrid stackup combining ITEQ and Shengyi laminates for optimized signal integrity.
• Ultra-precision drilling: Supports 0.10 mm laser microvias and 0.15 mm mechanical through-holes.
• Fine-line design: 100 μm trace width/spacing for high-density interconnects.
• Advanced surface treatment: Combines standard ENIG (2 μm) with localized heavy gold plating (50 μm) for critical RF pads/connectors.
• Rigorous thickness control: ±0.1 mm tolerance ensures compatibility with 5G mmWave antenna modules.

This specification aligns with 5G NR (New Radio) infrastructure requirements, targeting 24–40 GHz bands with insertion loss < 0.3 dB/inch at 28 GHz.