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3-Layer Rogers RO4350B High-Frequency PCB
Board Material Type: Rogers RO4350B
Number of Layers: 3L
Board Thickness: 3.53±10%mm
Surface Treatment: Immersion Gold
Mini. Line Width/Distance: 1.156/0.774mm

PRODUCT DETAILS

Product Type: High-Frequency Board

Application Field: Radio Frequency (RF)

Special Feature: Special Laminate Structure

Number of Layers: 3L

Board Thickness: 3.53±10%mm

Material: Rogers RO4350B

Surface Treatment: Immersion Gold

Inner/Outer Layer Copper Thickness: 1oZ / 1oZ (1 ounce per square foot for both inner and outer layers)

Minimum Line Width/Line Spacing: 1.156/0.774mm

Minimum Hole Diameter: 0.3mm




Rogers RO4350B laminate is a proprietary ceramic-filled hydrocarbon composite reinforced with woven glass fabric, combining the electrical performance of PTFE/glass fabric materials with the processability of epoxy/glass fabric.


RO4350B high-frequency laminate features a dielectric constant (Dk: 3.48+/-0.05) with tight tolerance control and low loss characteristics (Df: 0.0037@10GHz), making it easy for mass production with CAF resistance (resistant to ionic migration). The processing of RO4350B is comparable to that of standard epoxy/glass fabric.


RO4350B high-frequency boards are fully compatible with traditional PCB manufacturing techniques, eliminating the need for special pretreatment for through-hole copper plating (plasma treatment required for PTFE laminates) or other pretreatment processes. The solder resist process can also involve board grinding. Compared to traditional microwave material laminates, RO4350B offers a lower price point while meeting the UL 94V-0 flame retardant rating required for active devices and high-power RF designs.


RO4350B exhibits the following characteristics:

  1. Low RF loss: Df: 0.0037@10GHz
  2. Low dielectric constant: Dk: 3.48+/-0.05 with minimal temperature fluctuation
  3. Low Z-axis coefficient of thermal expansion: 32 ppm/°C
  4. Low in-plane coefficient of expansion
  5. Tight tolerance on dielectric constant
  6. Excellent dimensional stability
  7. Stable electrical properties across different frequencies
  8. Processing similar to FR-4 and easy for mass production and multilayer lamination with FR4, providing significant cost competitiveness
  9. Material thicknesses available for RO4350B high-frequency boards include: 4mil, 6.6mil, 10mil, 13.3mil, 16.6mil, 20mil, 30mil, and 60mil.

PRODUCT RECOMMENDATION

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    Board Thickness: 1.0mm
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  • 10-layer high-frequency PCB board
    Number of Layers: 10L
    Board Thickness: 1.0±0.1mm
    Surface Treatment: Gold Plating 2u"+ Locally Thick Gold Plating 50u"
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