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PRODUCT DETAILS
Special FPC Double-Sided Raised Point Connection Flexible Board
Material Structure: Double-Sided Adhesive + Low Loss Yellow Covering Film + (Line Copper + Adhesive + High Frequency Medium Polyimide Substrate + Adhesive + Line Copper) + Low Loss Yellow Covering Film
Resistance: Free Bending and Folding
Common Difference: ±0.03mm
Thickness: 0.15mm
Reinforcement: Front and Back 0.15mm SMT Stencil Stiffener
Production Process: Solder Coating, Plug Electroplating, Covering Layer, Film Coating Type, Solder Resistance Type Shielding
Surface Treatment: 1~2 Micro Inches of Gold Deposition
Minimum Line Width/Line Distance: 0.06mm/0.09mm
PRODUCT RECOMMENDATION
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See details- 4L Rigid-Flex PCB, Thinflex Adhesiveless+FR4 TU862(TG170), Immersion Gold
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