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PRODUCT DETAILS
Unit Size: Can be customized according to customer drawings
Processing Technology: Electrolytic Foil
Reinforcing Material: Glass Fiber Cloth Base
Insulating Resin: Polymylimide Resin (PI)
Substrate Material: Adhesive ED
Product Thickness: 0.2mm(Tolerance ±0.03mm)
Copper Thickness: 35μm(0.5oz)
Soldermask Film/Oil: Yellow Film/Black Film/White Film
Plating and Thickness: OSP(12um-36um)
Fire Rating: 94-V0
Temperature Test: Thermal Shock 288℃ 10sec
Dielectric Constant: PI 3.5; AD 3.9
Storage Environment: Dark Vacuum Storage, Temperature <25℃ Humidity <70%
PRODUCT RECOMMENDATION
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See details- 6 Layers FPC Flexible Circuit Board
- Number of Layers: 6 Layers
- Board Thickness: 0.25mm±0.03mm
- Surface Treatment: Immersion Gold
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See details- 8L Rigid-Flex PCB, Thinflex W-2005RD+FR4 TU768(TG170),Impedance control, Edge Plating
- Number of Layers: 8L
- Board Thickness: 1.30mm
- Surface Treatment: Immersion Gold(2u")
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See details- 7L Rigid-Flex PCB, Thinflex Adhesiveless+FR4 TU862(TG170), Eccobond 45 Clear Applicable"
- Number of Layers: 7L
- Board Thickness: 1.10mm
- Surface Treatment: Immersion Gold(2u")
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See details- 2L FPCB, 1mil PI, 0.5oz Cu, size:9x8.94mm, Solder mask+coverlay, Immersion Gold
- Number of Layers: 2L
- Board Thickness: 1mil
- Surface Treatment: Immersion Gold(2u")
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See details- 4L Rigid-Flex PCB, Thinflex Adhesiveless+FR4 TU862(TG170), Immersion Gold
- Number of Layers: 4L
- Board Thickness: 1.0mm
- Surface Treatment: Immersion Gold(2u")
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See details- 6-layer medical rigid-flex PCB
- Number of Layers: 6L
- Board Thickness: 1.5mm
- Surface Treatment: mmersion Gold
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See details- Special FPC Double-Sided Connection Flexible Board
- Number of Layers: 2 Layers
- Board Thickness: 0.15mm
- Surface Treatment: Immersion Gold
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See details- 1L FPCB, 1mil PI, 0.5oz Cu,Stiffener(PI), Immersion Gold
- Number of Layers: 1L
- Board Thickness: 1mil PI
- Surface Treatment: Immersion Gold(2u")
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