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PRODUCT DETAILS
| Layers | 6 |
| Finished Thickness(mm) | 3.6 |
| Material type | S1000-2M |
| Copper thickness(oz) | 3 oz (all Layers) |
| Minimum aperture (mm) | 0.45 |
| Minimum line width/line spacing (mm) | 0.20 |
| Other characteristics | Plated through-hole copper thickness ≥30 μm |
PRODUCT RECOMMENDATION
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See details- 6 Layer High Tg FR4 ENIG PCB
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- Board Thickness: 2.4
- Surface Treatment: Immersion Gold
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See details- 6 Layer FR4 ENIG Multilayer PCB
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See details- 6 Layer FR4 ENIG High Reliability PCB
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See details- 6 Layer FR4 Immersion Tin High Reliability PCB
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See details- 10 Layer FR4 ENIG Mass Production PCB
- Number of Layers: 10
- Board Thickness: 1.6
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See details- 4 Layer FR4 Immersion Gold Prototype PCB
- Number of Layers: 4
- Board Thickness: 0.50
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See details- 8 Layer FR4 Multilayer PCB with ENIG + OSP
- Number of Layers: 8
- Board Thickness: 0.80
- Surface Treatment: ENIG + OSP (Mixed Surface Finish)
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See details- 10 Layer FR4 Back Drilling PCB
- Number of Layers: 10
- Board Thickness: 1.6
- Surface Treatment: Immersion Tin
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