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PRODUCT DETAILS
| Layers | 6 |
| Finished Thickness(mm) | 2.4 |
| Material type | S1000-2M |
| Copper thickness(oz) | 2.5/2/2/2/2/2.5 |
| Minimum aperture (mm) | 0.30 |
| Minimum line width/line spacing (mm) | 0.15 |
| Other characteristics | BGA pitch (partial area): 0.2 mm |
PRODUCT RECOMMENDATION
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See details- 6 Layer FR4 Immersion Tin High Reliability PCB
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See details- 10 Layer FR4 ENIG Mass Production PCB
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See details- 4 Layer FR4 Immersion Gold Prototype PCB
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See details- 8 Layer FR4 Multilayer PCB with ENIG + OSP
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See details- 10 Layer FR4 Back Drilling PCB
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