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PRODUCT DETAILS
| Layers | 8 |
| Finished Thickness(mm) | 0.80 |
| Material type | S1000H |
| Copper thickness(oz) | 1 oz (all Layers) |
| Minimum aperture (mm) | 0.20 |
| Minimum line width/line spacing (mm) | 0.10 |
| Other characteristics | ENIG + OSP (Mixed Surface Finish) |
PRODUCT RECOMMENDATION
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See details- 6 Layer High Tg FR4 ENIG Heavy Copper PCB
- Number of Layers: 6
- Board Thickness: 3 oz (all Layers)
- Surface Treatment: Immersion Gold
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See details- 6 Layer High Tg FR4 ENIG PCB
- Number of Layers: 6
- Board Thickness: 2.4
- Surface Treatment: Immersion Gold
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See details- 6 Layer FR4 ENIG Multilayer PCB
- Number of Layers: 6
- Board Thickness: 1.6
- Surface Treatment: Immersion Gold
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See details- 6 Layer FR4 ENIG High Reliability PCB
- Number of Layers: 6
- Board Thickness: 0.8
- Surface Treatment: Immersion Gold
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See details- 6 Layer FR4 Immersion Tin High Reliability PCB
- Number of Layers: 6
- Board Thickness: 1.6
- Surface Treatment: Immersion Tin
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See details- 10 Layer FR4 ENIG Mass Production PCB
- Number of Layers: 10
- Board Thickness: 1.6
- Surface Treatment: Immersion Gold
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See details- 4 Layer FR4 Immersion Gold Prototype PCB
- Number of Layers: 4
- Board Thickness: 0.50
- Surface Treatment: Immersion Gold
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See details- 10 Layer FR4 Back Drilling PCB
- Number of Layers: 10
- Board Thickness: 1.6
- Surface Treatment: Immersion Tin
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