• PROJECT MANAGEMENT

PCB Manufacturing Capabilities for 1-40 Layers, High-precision, Special Process

Adopt advanced production equipment to achieve high quality production process, such as bare copper, immersion gold, immersion silver, HASL LF, OSP, buried hole, impedance control and other special processes we can do.

Project 2021 2022
Multilayer layer MAX protype:40L protype:42L
MAX mass:24L mass:30L
board thickness MIN protype:0.3mm protype:0.3mm
mass:0.4mm mass:0.4mm
MAX protype:5.0mm protype:6.4mm
mass:3.2mm mass:5.0mm
base copper inner layer MIN 0.5 OZ 0.5 OZ
MAX 6 OZ 6 OZ
outer layer MIN 1/3 OZ 1/3 OZ
MAX 6 OZ 6 OZ
hole size MIN protype:0.1mm
mass:0.15mm mass:0.1mm
hole tolerance MIN PTH:±0.05mm PTH:±0.05
NPTH:±0.025mm NPTH:±0.025mm
electroplating aspect ratio MAX protype:20:1 protype:22:1
mass:16:1 mass:10:1
routing tolerance MIN protype:±0.05mm protype:±0.05mm
mass:±0.10mm mass:±0.075mm
Line Width/Spacing inner layer MIN 0.06/0.06mm 0.05/0.05mm
outer layer MIN 0.075/0.075mm 0.075/0.075mm
Impedance tolerance MIN protype:±8%
mass:±10% mass:±8%
shipment size MIN protype:880*880mm protype:880*1200mm
MAX mass:800*800mm mass:800*800mm
BGA pad MIN 0.2mm 0.15mm
BGA spacing MIN 0.65mm 0.5mm
bow and twist MIN 0.005 0.005
special process gold finger、depth drill、back drill、cap plating
HDI layer MAX 16L 18L
board thickness MIN 0.3mm 0.3mm
hole size blind via MIN 0.075mm 0.05mm
buried via MIN 0.10mm 0.10mm
via MIN 0.10mm 0.10mm
hole tolerance MIN PTH:±0.05mm PTH:±0.05
NPTH:±0.025mm NPTH:±0.025mm
blind via aspect ratio MAX ≤0.8:1 ≤1:1
routing tolerance MIN protype:±0.05mm protype:±0.05mm
mass:±0.10mm mass:±0.075mm
Line Width/Spacing MIN 0.05/0.05mm 0.04/0.04mm
Laser blind via filling depression MIN 15/15um 15/10um
Impedance tolerance MIN ±10% ±8%
BGA pad MIN 0.15mm 0.15mm
BGA spacing MIN 0.35mm 0.3mm
bow and twist MIN 0.005 0.005

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