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PRODUCT DETAILS
The 6 Layers Bluetooth headset FPC flexible board is an electronic component that adopts a 6 Layers structure, including a 2R+2F+2R design, with a board thickness of 1.0mm and an outer copper thickness of 1 OZ. This flexible board is usually used in the manufacture of Bluetooth headphones, providing functions such as circuit connection and signal transmission for the headphones.
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