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PRODUCT DETAILS
Number of Layers: 6 Layers
• Base Material: FR4(TG175)
• Board Thickness: 1.60mm
• Copper Thickness: 1oz Cu
• Dimensions: 115 x 72 mm
• 3 pieces /PNL/135 x 240mm
• Soldermask: Green
• Silkscreen: White
• Immersion Gold (2u")
• Blind Hole L1-L2
• Buried by L2-L3
• Resin Filling
• Impedance Control
PRODUCT RECOMMENDATION
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