Sorry, no sales person is available right now to take your call. Pls leave a message and we will reply to you via email as soon as possible.
PRODUCT DETAILS
2 Layers Alumina Ceramic Substrate
DPC Technology
Double-Sided Metallization
Board Thickness: 1.0mm
Copper Thickness: 300um
Application: High Power Supply Circuit, IGBT
PRODUCT RECOMMENDATION
-
See details- 2-Layer Power Supply Ceramic Board PCB
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment: Immersion Gold
-
See details- 2 Layers Power Supply Ceramic PCB
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment: Immersion Gold
-
See details- DBC Aluminum Nitride Ceramic Substrate
- Number of Layers: Single Layer
- Board Thickness: 2.0mm
- Surface Treatment: Immersion Gold 2U"
-
See details- DPC Ceramic AI Intelligent Control Board
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment:
-
See details- Thin-Film Capacitive Aluminum Nitride Ceramic Substrate
- Number of Layers: Single-Sided
- Board Thickness: 0.4mm
- Surface Treatment: Immersion Gold
-
See details- Ceramic Substrates for Power Devices
- Number of Layers: Single-Sided, Double-Sided
- Board Thickness: 0.35-0.5mm
- Surface Treatment: Immersion Silver, Immersion Gold, ENEPIG
-
See details- 99% Alumina Ceramic Substrate
- Number of Layers: 2 Layers
- Board Thickness: 1.0mm
- Surface Treatment: ENEPIG
-
See details- Silicon Carbide Ceramic Substrate PCB
- Number of Layers: 2 Layers
- Board Thickness: 0.38mm
- Surface Treatment: Immersion Silver
Contact Us