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PRODUCT DETAILS
Substrate Type: Silicon carbide ceramics
Board Thickness: 0.38mm
Conductive Layer: Copper, Silver
Metal Layer Thickness: 5μm
Min. Line Width/Line Distance: 0.12/0.5mm
Conduction Hole: Hole Filling
Surface Treatment: Immersion Silver
PRODUCT RECOMMENDATION
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See details- Thin-Film Capacitive Aluminum Nitride Ceramic Substrate
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See details- 99% Alumina Ceramic Substrate
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