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Ceramic Substrates for Power Devices
Board Material Type: Ceramic Substrate
Number of Layers: Single-Sided, Double-Sided
Board Thickness: 0.35-0.5mm
Surface Treatment: Immersion Silver, Immersion Gold, ENEPIG
Mini. Line Width/Distance:

PRODUCT DETAILS

IGBT Substrate

Specification: 1200A12V, 1200A120V

Number of Layers: Single-Sided, Double-Sided

Surface Treatment: Immersion Silver, Immersion Gold, ENEPIG

Board Thickness: 0.35-0.5mm

Warpage: 0.3%

Base Material: Alumina (AL2O3, Aluminum Nitride (ALN)

Process: DBC

PRODUCT RECOMMENDATION

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