Home/ Products/ Thin-Film Capacitive Aluminum Nitride Ceramic Substrate

Thin-Film Capacitive Aluminum Nitride Ceramic Substrate
Board Material Type: Ceramic Substrate
Number of Layers: Single-Sided
Board Thickness: 0.4mm
Surface Treatment: Immersion Gold
Mini. Line Width/Distance: 0.15±0.005mm/0.07±0.005mm

PRODUCT DETAILS

Base Material: Aluminum Nitride

Board Thickness: 0.4mm

Min. Line Width/Line Distance: 0.15±0.005mm/0.07±0.005mm

Surface Treatment: Front Side: Au≥1.0μm; Back Side: Au≥0.5μm;

Application: Capacitors

Process: Min. line width 30μm, accurate etching thick gold

PRODUCT RECOMMENDATION

  • 2 Layer AMB Aluminum Nitride Ceramic Copper Clad PCB
    Number of Layers: 2
    Board Thickness: 0.38mm
    Surface Treatment:
    See details
  • 2 Layer AMB Silicon Nitride Ceramic Copper Clad PCB
    Number of Layers: 2
    Board Thickness: 0.32mm
    Surface Treatment:
    See details
  • 2‑Layer Alumina DBC Ceramic Copper Clad PCB for IGBT
    Number of Layers: 2
    Board Thickness: 0.635 mm
    Surface Treatment:
    See details
  • 2‑Layer Alumina DBC Ceramic Copper Clad PCB
    Number of Layers: 2
    Board Thickness: 1.0mm
    Surface Treatment: Green solder mask
    See details
  • Single‑Sided High‑Aluminosilicate Glass Substrate PCB
    Number of Layers: 1L
    Board Thickness: 1.0 mm
    Surface Treatment:
    See details
  • 2‑Layer Sodium–Calcium Glass Substrate PCB
    Number of Layers: 2L
    Board Thickness: 1.0 mm
    Surface Treatment:
    See details
  • 2-Layer Power Supply Ceramic Board PCB
    Number of Layers: 2 Layers
    Board Thickness: 1.0mm
    Surface Treatment: Immersion Gold
    See details
  • 2 Layers Power Supply Ceramic PCB
    Number of Layers: 2 Layers
    Board Thickness: 1.0mm
    Surface Treatment: Immersion Gold
    See details
Contact Us

Sorry, no sales person is available right now to take your call. Pls leave a message and we will reply to you via email as soon as possible.

0/800