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Thin-Film Capacitive Aluminum Nitride Ceramic Substrate
Board Material Type: Ceramic Substrate
Number of Layers: Single-Sided
Board Thickness: 0.4mm
Surface Treatment: Immersion Gold
Mini. Line Width/Distance: 0.15±0.005mm/0.07±0.005mm

PRODUCT DETAILS

Base Material: Aluminum Nitride

Board Thickness: 0.4mm

Min. Line Width/Line Distance: 0.15±0.005mm/0.07±0.005mm

Surface Treatment: Front Side: Au≥1.0μm; Back Side: Au≥0.5μm;

Application: Capacitors

Process: Min. line width 30μm, accurate etching thick gold

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